NS 202 - Basic Nanotechnology Processes

Credit Hours: 3

This course will introduce students to: top down, bottom up and hybrid nanofabrication; additive processes and sputtering; plasma, plasma setups and plasma deposition; subtractive processes and etching; RIE; wet etching; pattern transfer and lithography techniques; typical LPCVD systems for top down applications; 1D materials in bottom up applications; and physical vapor deposition.

Course Outcomes
At the completion of the course, the student will be able to:

describe main nanofabrication processes;
run basic additive and subtractive nanotechnology processes and equipment;
conduct pattern transfer and implement basic lithography techniques; and
effectively and safely work as a member of technical team on laboratory assignments.

Prerequisites: NS 201
Corequisites: NS 206
F/S (N)